1. Core Principle
Silane characteristics: SiH₄ is colorless, odorless, and highly flammable. It can spontaneously ignite in air (low autoignition temperature). The combustion reaction is:
SiH4 + 2O2 ---high temperature/autoignition--- SiO2 (dust) + 2H2O
This reaction releases a large amount of heat; if the concentration is uncontrolled, it can easily explode. Therefore, controlled dilution and forced combustion are necessary.
Working Process (Typical)
Pre-dilution: The exhaust gas is first mixed with nitrogen/air to control the SiH₄ concentration below 25% of the lower explosive limit (LEL), eliminating the risk of deflagration.
Combustion chamber incineration: The mixture enters a high-temperature combustion chamber (above 800℃, usually equipped with an igniter and flame stabilizer), where SiH₄ is completely combusted and decomposed into SiO₂ dust and water vapor.
Post-treatment purification:
Cyclone separation + ceramic filter tubes/baghouse dust collection to capture SiO₂ micro-dust (preventing blockage and emissions);
Spray scrubbing (optional): Removes byproduct acidic gases (such as HF, HCl), ammonia, etc., and neutralizes them for compliant discharge.
Emission: The purified gas is discharged into the atmosphere by an induced draft fan. II. Core Features and Advantages
High Safety: Dilution control + flame monitoring + emergency shutdown, addressing the self-ignition/explosion risk of SiH₄;
High Purification Efficiency: SiH₄ decomposition rate ≥99.9% (up to 99.99% for high-end models), completely eliminating the hazards of highly toxic and flammable substances;
Anti-Clogging Design: Multi-stage dust removal + backflushing, solving the problem of SiO₂ dust easily clogging pipelines/filter materials;
Strong Adaptability: Can handle mixed exhaust gases containing SiH₄, NH₃, HF, etc., compatible with continuous production conditions in semiconductor/photovoltaic industries.
2. Main Application Scenarios
Semiconductor wafer manufacturing (CVD/PECVD epitaxy, oxidation, deposition processes);
Solar cells/photovoltaic modules (crystalline silicon cell deposition, coating);
LED/display panels (MOCVD, PECVD processes);
SiH₄ exhaust gas treatment in other industries such as silicon-based thin films and special gas preparation.
3. Key Design and Operation & Maintenance Points
Safety First: Must include LEL interlocking, flame monitoring, over-temperature alarm, nitrogen purging/emergency venting;
Anti-Clogging Core: Reasonable design of the combustion chamber flow field, selection of high-temperature resistant filter materials + regular backflushing to prevent SiO₂ accumulation;
Material Selection: Hastelloy/310S for high-temperature zones, PP/FRP/fluorine-lined materials for washing zones, ensuring corrosion resistance and high-temperature resistance;
Operation & Maintenance: Regular dust cleaning, inspection of burners/flame detectors, and calibration of monitoring instruments to ensure continuous and stable operation.
Supplementary Information
Aliases: Silane combustion cylinder, silane emergency combustion tower, silane exhaust gas incineration and purification tower;
Difference from ordinary RTO/incinerators: Specifically designed for the high flammability and explosion risk of SiH₄, emphasizing pre-dilution, stable combustion, anti-clogging, and explosion prevention, rather than general VOCs incineration;
Compliance: Meets standards such as the "Comprehensive Emission Standard for Air Pollutants" and "Emission Standard for Pollutants from the Semiconductor Industry," making it a mainstream compliant solution for SiH₄ exhaust gas treatment.